Manual Bonding Systems
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Related Information
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FINEPLACER® lambda - Flexible Sub-Micron Bonder
The FINEPLACER® lambda is a flexible sub-micron bonder used for precise placement, die attach and advanced packaging. The system offers outstanding flexibility with a modular design and can be easily reconfigured for different applications. It is the ideal choice for low volume production, prototyping, education and R&D where process flexibility is the key.
Application Information for FINEPLACER® Micro Assembly Systems...
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FINEPLACER® pico ma - Multi-Purpose Bonder
The FINEPLACER® pico ma, a multi-purpose bonder, offers high placement accuracy (5 micron), allowing for bonding of the smallest die with a pitch of down to 50 µm. This versatile platform is used in a wide field of micro assembly applications – such as flip chip and die bonding. Designed for prototyping or low-volume production, R&D and universities.
Application Information for FINEPLACER® Micro Assembly Systems... |
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FINEPLACER® matrix ma - Semi-Automatic Bonder
The FINEPLACER® matrix ma is a newly developed, semi-automatic bonder that points the way forward for the Finetech product family. Incorporating a new ergonomic approach to bonder design, this state-of-the-art platform, with large working area and high placement accuracy, combines application modularity within an open hardware and software environment. Supporting a virtually unlimited field of applications and numerous bonding technologies, the system ensures compatibility with future technologies as users transition from R&D into production.
Application Information for FINEPLACER® Micro Assembly Systems... |
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